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alone BDM interface available (J32). This header is non-populated in the
default configuration and can be installed by the user if needed.
1.8.1 Integrated BDM
The DEMO9S08AW60E features an integrated USB-BDM debugger from
P&E Microcomputer Systems. All necessary signals are provided via the
integrated debugger. A USB type B connector (J33) provides the connection
between the DEMO9S08AW60E and your host PC.
The integrated debugger provides the DEMO9S08AW60E with power
eliminating the need to power the board externally. Power is derived from the
USB bus, therefore total current consumption should not exceed 500mA.
Excessive current drain will violate the USB spec and damage to your Host
PC’s USB hub or the DEMO9S08AW60E could occur.
1.8.2 BDM Header
J32 is the stand alone BDM header. Use of this port requires the user to solder
a 2 x 6 100 mil center header on the board. The pinout is as follows:
Table 1-2 BDM Connector (J32) Pinout
BKGD
NC
NC
1
3
5
2
4
6
GND
RESET_B
VDD
1.8.3 Socketed MCU
The MC9S08AW60 silicon is socketed on the DEMO9S08AW60E board. This
socket is an open top, spring actuated, 0.8mm pitch socket. It is made by Wells
Electronics, part number 7314-064-0-08. Before connecting power to the demo
board the silicon should be installed in this socket. Using your thumb and index
finger, press down on the socket until it is fully actuated. Place the silicon in the
socket with a vacuum pen or other chip lifting device. Pin 1 of the silicon
(denoted by an indented dot) should be in the bottom left hand corner, towards
the USB connector J33. Release the socket. The MC9S08AW60 silicon should
be centered within the socket and firmly held in place.
DEMO9S08AW60E User’s Guide, Rev. 0.3
Freescale Semiconductor
13
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